Low-temperature film-forming low thermal expansion polyimide
Achieve low thermal expansion with low-temperature film formation!
"Low-temperature film-forming low thermal expansion polyimide" can be formed at lower temperatures than conventional polyimides, which reduces thermal stress and allows for similar applications as epoxy and others. It achieves high production efficiency and labor savings, making it suitable for applications such as interlayer insulating films (for semiconductor devices, multilayer printed circuit boards, and package substrates). [Features] ■ Thermal expansion coefficient graded from 2 to 20 ppm/K (can match the thermal expansion coefficients of various substrates) ■ Varnish can be stored at room temperature *For more details, please download the PDF or feel free to contact us.
- Company：ウィンゴーテクノロジー
- Price：Other
